This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers. They offer expertise in both advanced and conventional packaging and testing, benefiting from economies of scale due to their high-volume manufacturing capabilities. By outsourcing backend manufacturing processes to OSATs, chip manufacturers can focus on their core competencies and experience faster turnaround times and reduced time-to-market.
This study focuses on pure-play OSATs and foundries offering packaging and testing services, excluding IDMs with in-house packaging capabilities. The research delves into market estimates and forecasts based on the revenue generated by OSATs and foundries through ATP services. The study analyzes end-user industries in detail, outlining the potential OSATs hold for enabling transformative trends like electric mobility, 5G deployments, and the Internet of Things (IoT) through advanced packaging technologies. Additionally, it examines the impact of industry consolidation and geopolitical factors on the OSAT market.
The primary goal of this study is to identify growth opportunities emerging from this space and assess factors that may accelerate or hinder market growth. It examines market segments based on end-user industries, packaging technology, interconnect type, and geography. The research includes findings from discussions with industry experts and stakeholders in the OSAT ecosystem, complemented by secondary research, to estimate market size and forecast growth up to 2027. Some of the key study highlights include insights into demand patterns across different regions and a comprehensive analysis of each end-user sector's OSAT opportunities. Additionally, the study examines the capital expenditure trend, the distribution of OSAT facilities, and the value chain of OSAT. The report also contains a competitive analysis, providing market shares for major players.
Author: Navdeep Saboo
Why is it Increasingly Difficult to Grow?
The Strategic Imperative 8™
The Impact of the Top 3 Strategic Imperatives on the Outsourced Semiconductor Assembly and Test (OSAT) Industry
Growth Opportunities Fuel the Growth Pipeline Engine™
Scope of Analysis
Classification of Semiconductor Packaging Technology
Classification of Semiconductor Packaging Technology (continued)
Classification of Semiconductor Packaging Technology (continued)
Classification of Semiconductor Packaging Technology (continued)
Classification of Semiconductor Packaging Technology (continued)
Classification of Semiconductor Packaging Technology (continued)
Classification of Semiconductor Packaging Technology (continued)
Key Participants in the OSAT Value Chain
Key Participants in the OSAT Value Chain (continued)
Segmentation by End Users
The Rise of Chiplets
Packaging Trends in Wide-bandgap (WBG) Semiconductors
Packaging Trends in WBG Semiconductors (continued)
Hybrid Bonding
Key Competitors
Growth Metrics
Growth Drivers
Growth Driver Analysis
Growth Driver Analysis (continued)
Growth Driver Analysis (continued)
Growth Driver Analysis (continued)
Growth Restraints
Growth Restraint Analysis (continued)
Growth Restraint Analysis (continued)
Growth Restraint Analysis (continued)
Growth Restraint Analysis
Growth Restraint Analysis (continued)
Forecast Assumptions
Revenue Forecast
Revenue Forecast by End User
Revenue Forecast by Packaging Type
Revenue Forecast by Interconnect Type
Packaging Interconnect Technologies—Global Market Share of OSATs, IDMs, and Foundries
Revenue Forecast by Region
OSAT Facilities by Region
Revenue Forecast Analysis
Revenue Forecast Analysis (continued)
Pricing Trends and Forecast Analysis
Pricing Trends and Forecast Analysis (continued)
Competitive Environment
Revenue Share
Revenue Share Analysis
Revenue Share Analysis (continued)
OSAT Landscape—Capex Trend
OSAT Landscape—Analysis of Top 25 Pure-play OSATs
Notable ATMP Investments Globally
Notable ATMP Investments Globally (continued)
ATMP Investment Landscape, 2020–2023
OSATs’ Recipe for Success
Analysis of Competition
Analysis of Competition (continued)
M&A Analysis
M&A Analysis (continued)
M&A Analysis (continued)
Indian Semiconductor Industry
Indian Semiconductor Policy
Indian Semiconductor Policy (continued)
Revenue Forecast—Indian ATMP Landscape
Revenue Forecast Analysis—ATMP Market
Indian OSAT Opportunities
Indian ATMP Landscape—Current Scenario
Indian ATMP Landscape—Current Scenario (continued)
India ATMP Capabilities
Developments in the Indian ATMP Sector
Key Pillars for Implementation of Smart Manufacturing in OSATs
AI/ML in Semiconductors Packaging and Testing
Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape
Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape (continued)
Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape (continued)
Notable AI/ML Solutions for ATMP—Impact Analysis Dashboard
Notable AI/ML Solutions for ATMP—Impact Analysis (continued)
Case #1: End-to-End Software Solution for Efficient OSAT Operations
Case #2: Exensio OSAT by PDF Solutions
Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Forecast Analysis (continued)
AiP for 5G
Evolution of RF FEM, Antenna, and Packaging Technology in Smartphones with Network Generations
Competitive Environment
Revenue Share
Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Forecast Analysis (continued)
Global 5G Adoption—2021 and 2025
Competitive Environment
Revenue Share
Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Forecast Analysis (continued)
Competitive Environment
Revenue Share
Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Forecast Analysis (continued)
Competitive Environment
Revenue Share
Top 5 Trends in the Semiconductor Ecosystem for Sustainability and the Circular Economy
Semiconductor Ecosystem Alignment with UN SDGs Critical to Paving the Path to Decarbonization
Key Sustainability Factors for OSATs
UN SDGs
Amkor Technology
ASE Technology
Growth Opportunity 1: Validation and Verification for HI
Growth Opportunity 1: Validation and Verification for HI (continued)
Growth Opportunity 2: Industry 4.0 for Improving Margins and Efficiency
Growth Opportunity 2: Industry 4.0 for Improving Margins and Efficiency (continued)
Growth Opportunity 3: Strategic Upstream and Downstream Efforts
Growth Opportunity 3: Strategic Upstream and Downstream Efforts (continued)
Growth Opportunity 4: 3D Printing in Semiconductor Packaging
Growth Opportunity 4: 3D Printing in Semiconductor Packaging (continued)
Growth Opportunity 5: Digital Transformation for Efficiently Tackling Shocks
Growth Opportunity 5: Digital Transformation for Efficiently Tackling Shocks (continued)
Growth Opportunity 6: M&As
Growth Opportunity 6: M&As (continued)
Your Next Steps
Why Frost, Why Now?
List of Exhibits
List of Exhibits (continued)
List of Exhibits (continued)
Legal Disclaimer
List of Figures- WBG Semiconductors: Conventional Power Module Packaging, Global, 2019–2032
- OSAT: Growth Metrics, Global, 2022
- OSAT: Growth Drivers, Global, 2023–2027
- OSAT: Growth Restraints, Global, 2023–2027
- OSAT: Revenue Forecast, Global, 2019–2027
- OSAT: Revenue Forecast by End User, Global, 2019–2027
- OSAT: Revenue Forecast by Packaging Type, Global, 2019–2027
- OSAT: Revenue Forecast by Interconnect Type, Global, 2019–2027
- Market Share of OSATs, IDM, and Foundries across the Packaging Technologies, Global, 2022
- OSAT: Revenue Forecast by Region, 2019–2027
- OSAT: Number of OSAT Facility Locations by Top Countries/Regions, Global, 2022
- OSATs and Foundries Market Share, Global 2022
- OSAT: Gross Margin Analysis of Top 10 OSATs, Global, 2019–2025
- OSAT: Revenue Share of Top Participants, Global, 2022
- OSAT: Analysis of Top 25 OSATs by Headquarter Location, Global, 2022
- OSAT: Analysis of Top 25 OSATs by ATP Revenue, Global, 2022
- Investment Trend Analysis Between IDMs/Foundries and OSATs, Global, 2020–2023
- OSAT: Notable ATMP Investments by Country, Global, 2020–2023
- Global OSAT Market, Number of M&As, Global, 2011–2023*
- OSAT: M&As by Headquarter Locations of Acquired Company, Global, 2011–2023
- OSAT: M&A by Headquarter Location of the Acquiring Company, Global, 2011–2023
- ATMP: Revenue Forecast, India, 2022–2027
- Mobile & Consumer Electronics: Growth Metrics, Global, 2022
- Mobile & Consumer Electronics: Revenue Forecast, Global, 2019–2027
- Mobile & Consumer Electronics: Revenue Forecast by Interconnect Type, Global, 2019–2027
- Mobile & Consumer Electronics: Revenue Forecast by Packaging Type, Global, 2019–2027
- Mobile & Consumer Electronics: Revenue Forecast by Region, 2019–2027
- Smart Home Technologies, Global Revenue, 2021–2027
- 5G Semiconductors: AiP in 5G—Use Cases, Global, 2022
- Mobile & Consumer Electronics: Revenue Share of Top Participants, Global, 2022
- Telecom & Infrastructure: Growth Metrics, Global, 2022
- Telecom & Infrastructure: Revenue Forecast, Global, 2019–2027
- Telecom & Infrastructure: Revenue Forecast by Interconnect Type, Global, 2019–2027
- Telecom & Infrastructure: Revenue Forecast by Packaging Type, Global, 2019–2027
- Telecom & Infrastructure: Revenue Forecast by Region, 2019–2027
- Telecom & Infrastructure: Revenue Share of Top Participants, Global, 2022
- Automotive & Transportation: Growth Metrics, Global, 2022
- Automotive & Transportation: Revenue Forecast, Global, 2019–2027
- Automotive & Transportation: Revenue Forecast by Interconnect Type, Global, 2019–2027
- Automotive & Transportation: Revenue Forecast by Packaging Type, Global, 2019–2027
- Automotive & Transportation: Revenue Forecast by Region, 2019–2027
- Automotive & Transportation: Revenue Share of Top Participants, Global, 2022
- Others: Growth Metrics, Global, 2022
- Others: Revenue Forecast, Global, 2019–2027
- Others: Revenue Forecast by Interconnect Type, Global, 2019–2027
- Others: Revenue Forecast by Packaging Type, Global, 2019–2027
- Others: Revenue Forecast by Region, 2019–2027
- Others: Revenue Share of Top Participants, Global, 2022
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This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers. They offer expertise in both advanced and conventional packaging and testing, benefiting from economies of scale due to their high-volume manufacturing capabilities. By outsourcing backend manufacturing processes to OSATs, chip manufacturers can focus on their core competencies and experience faster turnaround times and reduced time-to-market.
This study focuses on pure-play OSATs and foundries offering packaging and testing services, excluding IDMs with in-house packaging capabilities. The research delves into market estimates and forecasts based on the revenue generated by OSATs and foundries through ATP services. The study analyzes end-user industries in detail, outlining the potential OSATs hold for enabling transformative trends like electric mobility, 5G deployments, and the Internet of Things (IoT) through advanced packaging technologies. Additionally, it examines the impact of industry consolidation and geopolitical factors on the OSAT market.
The primary goal of this study is to identify growth opportunities emerging from this space and assess factors that may accelerate or hinder market growth. It examines market segments based on end-user industries, packaging technology, interconnect type, and geography. The research includes findings from discussions with industry experts and stakeholders in the OSAT ecosystem, complemented by secondary research, to estimate market size and forecast growth up to 2027. Some of the key study highlights include insights into demand patterns across different regions and a comprehensive analysis of each end-user sector's OSAT opportunities. Additionally, the study examines the capital expenditure trend, the distribution of OSAT facilities, and the value chain of OSAT. The report also contains a competitive analysis, providing market shares for major players.
Author: Navdeep Saboo
| Deliverable Type | Market Research |
|---|---|
| Author | Navdeep Saboo |
| Industries | Electronics and Sensors |
| No Index | No |
| Is Prebook | No |
| Keyword 1 | Outsourced Semiconductor Assembly and Test |
| Keyword 2 | Outsourced Semiconductor Solutions |
| Keyword 3 | Trends in Outsourced Semiconductor Industry |
| List of Charts and Figures | WBG Semiconductors: Conventional Power Module Packaging, Global, 2019–2032~ OSAT: Growth Metrics, Global, 2022~ OSAT: Growth Drivers, Global, 2023–2027~ OSAT: Growth Restraints, Global, 2023–2027~ OSAT: Revenue Forecast, Global, 2019–2027~ OSAT: Revenue Forecast by End User, Global, 2019–2027~ OSAT: Revenue Forecast by Packaging Type, Global, 2019–2027~ OSAT: Revenue Forecast by Interconnect Type, Global, 2019–2027~ Market Share of OSATs, IDM, and Foundries across the Packaging Technologies, Global, 2022~ OSAT: Revenue Forecast by Region, 2019–2027~ OSAT: Number of OSAT Facility Locations by Top Countries/Regions, Global, 2022~ OSATs and Foundries Market Share, Global 2022~ OSAT: Gross Margin Analysis of Top 10 OSATs, Global, 2019–2025~ OSAT: Revenue Share of Top Participants, Global, 2022~ OSAT: Analysis of Top 25 OSATs by Headquarter Location, Global, 2022~ OSAT: Analysis of Top 25 OSATs by ATP Revenue, Global, 2022~ Investment Trend Analysis Between IDMs/Foundries and OSATs, Global, 2020–2023~ OSAT: Notable ATMP Investments by Country, Global, 2020–2023~ Global OSAT Market, Number of M&As, Global, 2011–2023*~ OSAT: M&As by Headquarter Locations of Acquired Company, Global, 2011–2023~ OSAT: M&A by Headquarter Location of the Acquiring Company, Global, 2011–2023~ ATMP: Revenue Forecast, India, 2022–2027~ Mobile & Consumer Electronics: Growth Metrics, Global, 2022~ Mobile & Consumer Electronics: Revenue Forecast, Global, 2019–2027~ Mobile & Consumer Electronics: Revenue Forecast by Interconnect Type, Global, 2019–2027~ Mobile & Consumer Electronics: Revenue Forecast by Packaging Type, Global, 2019–2027~ Mobile & Consumer Electronics: Revenue Forecast by Region, 2019–2027~ Smart Home Technologies, Global Revenue, 2021–2027~ 5G Semiconductors: AiP in 5G—Use Cases, Global, 2022~ Mobile & Consumer Electronics: Revenue Share of Top Participants, Global, 2022~ Telecom & Infrastructure: Growth Metrics, Global, 2022~ Telecom & Infrastructure: Revenue Forecast, Global, 2019–2027~ Telecom & Infrastructure: Revenue Forecast by Interconnect Type, Global, 2019–2027~ Telecom & Infrastructure: Revenue Forecast by Packaging Type, Global, 2019–2027~ Telecom & Infrastructure: Revenue Forecast by Region, 2019–2027~ Telecom & Infrastructure: Revenue Share of Top Participants, Global, 2022~ Automotive & Transportation: Growth Metrics, Global, 2022~ Automotive & Transportation: Revenue Forecast, Global, 2019–2027~ Automotive & Transportation: Revenue Forecast by Interconnect Type, Global, 2019–2027~ Automotive & Transportation: Revenue Forecast by Packaging Type, Global, 2019–2027~ Automotive & Transportation: Revenue Forecast by Region, 2019–2027~ Automotive & Transportation: Revenue Share of Top Participants, Global, 2022~ Others: Growth Metrics, Global, 2022~ Others: Revenue Forecast, Global, 2019–2027~ Others: Revenue Forecast by Interconnect Type, Global, 2019–2027~ Others: Revenue Forecast by Packaging Type, Global, 2019–2027~ Others: Revenue Forecast by Region, 2019–2027~ Others: Revenue Share of Top Participants, Global, 2022~ |
| Podcast | No |
| WIP Number | K901-01-00-00-00 |
Global Outsourced Semiconductor Assembly and Test Growth Opportunities
Global Outsourced Semiconductor Assembly and Test Growth Opportunities
Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth
RELEASE DATE
13-Oct-2023
13-Oct-2023
REGION
Global
Global
Deliverable Type
Market Research
Market Research
Research Code: K901-01-00-00-00
SKU: ES_2023_225
$4,950.00
In stock
SKU
ES_2023_225