Wireless communication systems rely on semiconductor components, such as PAs, LNAs, and transceivers (together known as RF FEMs), to process signals to and from the radio unit (RU), baseband unit (BBU), and the network core to ensure customers receive the radio signals that carry the data and services.
The communication system relies on other semiconductor components, such as antenna integrated circuits (ICs), envelope trackers, microprocessors, analog devices, and optical components, to process signals as necessary. The type of semiconductors that wireless telecom communication uses has not changed much with the 2G to 5G evolution of technologies. However, the semiconductor components’ performance requirements have increased. Hence, the designs, materials, manufacturing, and packaging technologies have evolved with each new wireless communication generation.
Because 5G wireless technology is in the deployment stage, industry leaders have begun discussions about developing the next-gen wireless technology (6G) and plan to begin early commercialization in 2030. The dawn of 6G will represent a new era of communication that will provide new services beyond data. The study discusses distributed and federated learning at the edge, co-inferencing between edge and core, autonomous functioning of end devices, the development of AI-powered human-centric telecom services, joint communication, computing, sensing, and control, and several other concepts, which represent a transformation from radio access network (RAN) architecture to services.
To develop 6G, industry stakeholders are collaborating to plan the components and building blocks of each sub-technology that will lead to the development of the next-gen wireless technology. Initial stakeholder discussions are leading to an understanding that advanced semiconductors with high-performance capabilities (in computing and RF) will be necessary to enable high-speed data transfer and operate at high frequencies.
• This analysis aims to understand the changes expected in 6G wireless communication from a context of the semiconductor industry, with specific focus on RAN, and the edge.
• From a component perspective, the analysis focuses on the AI-processors, and the key RF components required at the network RAN and the edge.
• The analysis does not cover the changes expected in discrete, analog, memory, optical, and sensing products.
• It aims to provide a qualitative view based on the developments during the study period and is subject to change in the future.
• It does not aim to provide a quantitative overview of the market potential.
Author: Prabhu Karunakaran
The Impact of the Top 3 Strategic Imperatives on the 6G Semiconductors Industry
Disruptive Technologies
- Why: The next-generation (next-gen) wireless technology, 6G, will tentatively operate at high frequencies (more than 100 gigahertz (GHz) and support 1 terabit per second (Tbps) data rates with much lower latency (10.1 milliseconds (ms) than 5G networks). These improvements offer 100 to 1000 times in efficiencies over current 5G networks.
- Moreover, 6G will represent the dawn of a new era where networks will move from enabling connected things to cognitive intelligence.
- Frost Perspective: Because 6G promotes joint communication, computing, and sensing, customer power on the (including in and desired) gains significance. The 6G ecosystem will introduce innovative, AI-powered distributed learning. Therefore investments in AI for edge computing will be crucial.
Geopolitical Chaos
- Why: To meet 6G operational targets, the semiconductor industry requires scaled-up production of next-gen semiconductors that use miniaturized transistors smaller than existing sub-5-nanometer (nm) transistors to deliver the required performance.
Manufacturing products in the sub-3 nm nodes at extreme ultraviolet (EUV) and other process tools at the center of U.S. trade sanctions, which means China’s ability to acquire EUV will be curtailed. - Frost Perspective: Based on the status of U.S.-China trade sanctions, the United States will be the leader for 6G in the next decade, and chip production is likely to stay concentrated in the U.S. and allied nations. States using 6G in the RF and AI spaces due to their semiconductor prowess will also round out their technology control network.
Internal Challenges
- Why: The skill shortage widely impacts the semiconductor industry by increasing time-to-market and cost issues across design and manufacturing processes. Because 6G has scheduled launch in 2030, billions of end devices must be 6G-capable, which requires semiconductor engineers to design systems on a chip (SoCs) and RF front-end modules (FEMs).
If the industry does not shorten the time-to-market and lower the design costs, the skill shortage will compound. - Frost Perspective: Overcoming a skill shortage with software (SW) solutions is not a new approach. Engineers need to amend FDA solutions to work across 6G design and manufacturing processes. A design automation approach with AI-enabled systems can alleviate critical skills gaps and allow suggestions across design areas; enabling systems must automatically update to integrate different processes and yield issues stemming from design iterations.
Growth Drivers
6G Semiconductors: Growth Drivers, Global, 2024–2033
Driver
- Semiconductors will be necessary to develop 6G wireless technology across RANs and the edge, leading to advanced semiconductor devices and, therefore, new sales because 6G systems’ bill of materials will change: The rapidly increasing number of connected devices and growing data volumes indicate that 5G wireless networks will run out of capacity by the end of this decade. Therefore, initial discussions, planning, and research to develop next-gen wireless technology (6G) have begun. Semiconductors, specifically AI processors and RF FEMs (semiconductor components that enable wireless communication) will find high demand in enabling 6G technology from RAN to the edge (including end devices).
- Semiconductor device manufacturers must develop advanced components that utilize leading-edge process nodes and new materials to deliver 6G's performance requirements. Therefore, 6G's new technology requirements will drive sales of new semiconductors.
- Sustainability requirements will drive performance requirements and increase the average selling price of semiconductors for 6G: The growing demand for green energy and energy efficiency propels the demand for improved semiconductor performance in 6G, leading to R&D for existing CMOS platforms and devices based on new materials and manufacturing technologies.
- The emergence of new applications and use cases will drive the need for more semiconductors: Holographic communication, advanced XR/virtual reality (VR)-based communications, and Level 4 (L4)/Level 5 (L5) autonomous vehicles (AVs) are some of the applications that will drive the need for near-zero latency and intelligence services, which require next-gen semiconductor devices with joint communication, computing, sensing, and control capabilities. These applications will drive the development of advanced SoCs with AI capabilities and next-gen RF components, driving autonomous learning and control at the edge and decreasing data transfer to 6G RANs.
Growth Restraints
Spectrum Sharing: 6G wireless technology will be a service enablement network that emphasizes delivering reliable, high-speed, intelligent services for next-gen applications, such as autonomous vehicles and smart cities. These use cases have several incumbent users in some of 6G’s frequency bands, and moving those users through new spectrum auctions will be expensive. The industry is exploring innovative spectrum-sharing solutions to get directions in the initial phase of research, but, until then, research progress will find many challenges.
Capital Expenditure: The global telecom market was in decline and it remains so, which directly impacts equipment vendors’ CAPEX budgets and revenue realization opportunities. As a result, ROI for current 5G technology is lagging. This will affect the re-evaluation of research investments in 6G. The global realization of 6G will require new base stations and infrastructure. Therefore, developing high ROI applications is an important case to make to investors.
Cybersecurity: Cybersecurity threats increase every year, and so does the economic loss stemming from these issues. Network resiliency to cybersecurity threats decreases with greater network complexity. 6G entails a multi-fold increase in network complexity and multi-vendor scenarios will become the norm. Threats will, therefore, increase exponentially. The efforts spent in finding ways to solve cybersecurity issues will hamper short-term research progress.
Health Hazard: There is no clear solution to the ill effects of high-frequency radiation (100 GHz to 3 THz) on humans and animals. Identifying potential technology candidates to mitigate those issues and incorporating them into research will consume time and resources, slowing research progress.
Why is it Increasingly Difficult to Grow?
The Strategic Imperative 8™
The Impact of the Top 3 Strategic Imperatives on the 6G Semiconductors Industry
Growth Opportunities Fuel the Growth Pipeline Engine™
Primary Findings
Scope of Analysis
6G—Overview of Cellular Evolution and Desired 6G Network Characteristics
Why 6G? Why Now?
6G Roadmap to Commercialization
6G—Integrated Technology Roadmap
Growth Drivers
Growth Restraints
6G Ecosystem
Why are AI Processors Critical for 6G?
Infusing AI into RAN for the Future of Telecom—Open Radio Access Network (ORAN) Infrastructure
AI in 6G Network Infrastructure—Emergence of AI-RAN
Edge Computing
Edge AI in 6G—Potential Application Universe
Primary Focus Areas for Edge AI Chipsets in the 6G Network
Understanding Current Processors to Evaluate 6G Requirements— Primary Companies and Products
AI in 6G—How to Determine Compute Performance Requirements
The Coming of Silicon Photonics (SiPh)
Regional Competency of AI Semiconductors for 6G Networking
Notable Developments, Initiatives, Activities, and Collaborations to Realize 6G Technology
Notable Investments in AI by Semiconductor Companies
The AI-Semiconductor Ecosystem for 6G
Expected Research Efforts in the Next 5 Years
AI in 6G—The Significance of Cybersecurity and Sustainability
RF Semiconductors in 6G—Enabling 100 GHz and Higher Operational Frequencies
RF Semiconductors in 6G—Process Node Trajectory
RF Semiconductors in 6G—Exploring Materials Beyond Si
RF Semiconductors in 6G—Exploring Materials Beyond Si: GaN
RF Semiconductors in 6G—Exploring Materials Beyond Si: InP
RF Semiconductors in 6G—Advanced Packaging Technologies
RF Semiconductors in 6G—GaN and InP Gaining R&D Traction for Application in Next-gen Wireless Technology
RF in 6G—Primary Products Enabling the Research and Development of 6G
RF in 6G Investments and R&D Initiatives that Semiconductor Companies Have Announced
RF in 6G—Primary Regional Initiatives and Investments
RF in 6G—Ultra-wide Bandgap (UWBG) Semiconductors
The AI Semiconductor Ecosystem in 6G
6G Research and Collaboration Initiatives by Primary Regions
6G Research and Collaboration Initiatives by Primary Regions (continued)
6G Research and Collaboration Initiatives by Primary Regions (continued)
6G Patent Applications by Region (2019–2021)
Semiconductors for 6G—Context of Opportunities by Primary Applications: AVs and Smart Manufacturing
Semiconductors for 6G—Context of Opportunity by Primary Applications: Healthcare and Smart Cities
Application Profile—Industry Metaverse
Application Profile—Mobility
Growth Opportunity 1—Cognitive Intelligence at the Core and Edge
Growth Opportunity 1—Cognitive Intelligence at the Core and Edge (continued)
Growth Opportunity 2—Application-specific Chipsets
Growth Opportunity 2—Application-specific Chipsets (continued)
Growth Opportunity 3—Leverage Government Funding and Policies
Growth Opportunity 3—Leverage Government Funding and Policies (continued)
List of Exhibits
Legal Disclaimer
- 6G Semiconductors: Growth Drivers, Global, 2024–2033
- 6G Semiconductors: Growth Restraints, Global, 2024–2033
- RF Semiconductors in 6G: Compound Semiconductor Patents Published, Global, 2020–2022
- Semiconductors in 6G: 6G Patent Applications, Global, 2018–2020
- 6G: Patent Publication, Percent Patent Publication by Jurisdiction, Global, 2019–2021
- Semiconductors in 6G: 5G Patent Applications, Global, 2010–2012
- Automotive Vision 2030: Addressable Market Opportunity for Automotive Connected Cars IVP, Global, 2025 and 2030
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| Deliverable Type | Market Research |
|---|---|
| Author | Prabhu Karunakaran |
| Industries | Electronics and Sensors |
| No Index | No |
| Is Prebook | No |
| Keyword 1 | 6G Wireless Technology Market |
| Keyword 2 | 6G Technology Market |
| Keyword 3 | 6G Market |
| List of Charts and Figures | 6G Semiconductors: Growth Drivers, Global, 2024–2033~ 6G Semiconductors: Growth Restraints, Global, 2024–2033~ RF Semiconductors in 6G: Compound Semiconductor Patents Published, Global, 2020–2022~ Semiconductors in 6G: 6G Patent Applications, Global, 2018–2020~ 6G: Patent Publication, Percent Patent Publication by Jurisdiction, Global, 2019–2021~ Semiconductors in 6G: 5G Patent Applications, Global, 2010–2012~ Automotive Vision 2030: Addressable Market Opportunity for Automotive Connected Cars IVP, Global, 2025 and 2030~ |
| Podcast | No |
| WIP Number | K979-01-00-00-00 |
Growth Opportunities in Semiconductors for 6G Wireless Technology
AI Chipsets and Compound Semiconductors Will Play a Transformational Role, Enabling the Operational and Economic Targets of Next-gen Cellular Wireless Technology
26-Jul-2024
Global
Market Research
